+49 721 597 970 71 sales@keystone-photonics.com

Additive manufacturing of lensed fiber probes for wafer-level testing and improved optical coupling

Operational since 2017, since 2023 as Keystone Photonics.

 

Product Range

Custom Optics

Lens with high NA for die-level laser and PIC testing.
Lens with low NA for die-level spot-size converter testing.
Large working-distance for wafer-level testing of grating couplers with well-defined best coupling position.
Collimated output with up to 30 μm MFD for coupling to other lensed devices.
Asymmetric lenses with 0° to 20° deflection.
90° deflection for wafer-level testing of edge-coupling devices in 100 μm trenches.
Large working-distance for extra clearance.
85° emission for better top-view camera vision. Other angles available upon request.
More options and design&simulation service available upon request. E.g. cryo compatible, extended wavelength range, anamorphic lens designs, metal-coated optics etc.

 

Fiber Arrays

 

 Fiber arrays up to 64 channels
Lensed fiber arrays for both die and wafer level testing of angled facets (e.g. InP laser, SOA, SLED).

Any pitch, fiber type, mixed fiber arrays, PM fiber arrays, cryo, UV, VIS NIR fiber arrays are available upon request.

Every channel of a fiber array can be equipped with different optics.

Range of 3D-printed markers for top- and bottom-view camera alignment.

Suitable for surface and trench coupling.

Photonic integrated circuits (PIC) can be used as a means for pitch equalization or pitch reduction to 20 µm.

Such probe heads allow testing of ultra-low pitch photonic integrated circuits both using grating and edge-coupled devices.

PIC may be equipped with 3D-printed mirror optics or a straight lens.

 

 

Custom Fiber Array Mounting

  • Adhesive-based mounting process on customer specific carrier
  • We accept customer holder or fabricate according to your drawing
  • Bonding process is validated with -40°C to 85°C cycles for AlN, Al, CuW, Invar

 

Test & Validation

 

  • Pitch accuracy control report
  • 100% tracability
  • 100% microscopy inspection
  • Optional inspection report

Optional mode-field and transmission measurements.

 

Our Applications

Wafer-level Testing

 

Mirrored lenses for trench coupling

Lenses for surface coupling

 

 

Astrophotonics

Lenses printed on multi-core fibers for astrophotonics

 

Cryo and Quantum Applications

Data Centers and Medical Devices

Request Form for Standard Products

Standard Corpus Types (µm)

              Corpus type A

              Corpus type B

Corpus type C

            Corpus type D

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Optional markers compatible with commercial probe stations

  • All calculations were done with Gaussian approximation
  • All MFD are specified at 1/e² intensity level
  • MFDs correspond to UHNA4 and SMF28 fiber (except for smallest MFD)
  • WD is measured from apex of lens to waist
  • Measured coupling efficiency is pending, estimated coupling is 0.5 dB for large MFD,
    1 dB for smallest MFD, TIR surface has 0.1-0.3 dB penalty

Our Technology in a Nutshell
Optical Wafer-Level Testing

Watch Keystone Photonics: 1 hour 23 minutes

Watch Keystone Photonics: 1 hour 42 minutes

Watch Keystone Photonics: 6:48 minutes

Our jobs

We do not have open positions at the moment, but you can always send us an unsolicited application at jobs@keystone-photonics.com

Reliable and industry-proven fabrication services of validated photonic components for wafer-level testing and free-space coupling.