+49 721 597 970 71 sales@keystone-photonics.com

reliable and industry-proven fabrication services of validated photonic components for wafer-level testing and free-space coupling

operational since 2017, since 2023 as Keystone Photonics

 

product range

custom optics

  • …large variety of standard models
  • all shown designs are validated by performance and reliability test and
    used for a large variety of customer’s application
lens with high NA for die-level laser and PIC testing
lens with low NA for die-level spot-size converter testing
large working-distance for wafer-level testing of grating couplers with well-defined best coupling position
collimated output with up to 30 μm MFD for coupling to other lensed devices
asymmetric lenses with 0° to 20° deflection
90° deflection for wafer-level testing of edge-coupling devices in 100 μm trenches
large working-distance for extra clearance
85° emission for better top-view camera vision. Other angles available upon request
more options and design&simulation service available upon request. E.g. cryo compatible, extended wavelength range, anamorphic lens designs, metal-coated optics etc…

 

fiber array

• fiber arrays tailored for wafer and die-level testing
• with lid, no lid, narrow etc

 

large quantity of 8ch fiber arrays with 127 µm and 250 µm on stock. Fiber arrays with up to 64 ch on stock

lensed fiber arrays for both die and wafer level testing of angled facets (e.g. InP laser, SOA, SLED)

any pitch, fiber type, mixed fiber arrays, PM fiber arrays, cryo, UV, VIS NIR fiber arrays available upon request

every chanel of a fiber array can be equipped with a different optics

range of 3D-printed marker for top- and bottom view camera alignment

suitable for surface and trench coupling

range of 3D-printed marker for top- and bottom view camera alignment

suitable for surface and trench coupling

photonic integrated circuits (PIC) can be used as a means for pitch equalization or pitch reduction to 20 µm

such probe heads allow testing of ultra-low pitch photonic integrated circuits both using grating and edge-coupled devices

the PIC may be equipped with 3D-printed mirror optics or a straight lens

 

 

custom fiber array mounting

  • adhesive-based mounting process on customer specific carrier
  • we accept customer holder or fabricate according to your drawing
  • bonding process is validated with -40°C to 85°C cycles for AlN, Al, CuW, Invar

 

test & validation

 

  • pitch accuracy control report
  • 100% tracability
  • 100% microscopy inspection
  • optional inspection report

optional mode-field and transmission measurements

 

packaging

 

  • validated packaging
  • customer specific variation available

 

application areas

photonic test & measurement

industry proven solutions for wafer-level and die level testing for edge and surface coupling

optical communication

in-situ printed freeform optics for
photonic system assembly

free space communication

3D-printed optics to enhance performance of space communication devices

quantum communication

3D-printed optics compatible with ultra-low cryogenic temperatures

research & novel devices

we provide novel devices for a large variety of application ranging from Astro Photonics to Medical devices

business segments

design services

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standard products

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custom products

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fabrication & technology

fabrication & technology

fabrication & technology

request form for standard products

standard corpus types (µm)

corpus type A

corpus type B

corpus type C

corpus type D

please select features

3 + 6 =

optional marker structure needed? – take your pick!

  • all calculations were done with Gaussian approximation
  • all MFD are specified at 1/e² intensity level
  • MFDs correspond to UHNA4 and SMF28 fiber (except for smallest MFD)
  • WD is measured from apex of lens to waist
  • measured coupling efficiency is pending, estimated coupling is 0.5 dB for large MFD,
    1 dB for smallest MFD, TIR surface has 0.1-0.3 dB penalty

information about data protection you can find in our privacy section

the terms you can find here

our technology in a nutshell
optical wafer-level testing

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offering reliable and industry-proven fabrication services of validated photonic components using additive microfabrication